Höllmüller OSP System by TSK
No harmful chemicals. Low cost. Eco-friendly. Organic protective coating that preserves solderability through long-term storage.
The Höllmüller OSP system by TSK applies a thin organic protective layer (Organic Solderability Preservative) to PCB copper surfaces. The process uses no harmful chemicals, making it one of the most environmentally friendly final finish options available. The protective layer is applied uniformly, then dried and cured to ensure consistent coating strength. Excellent solderability is maintained even after long-term storage and before assembly. Low material costs and minimal waste treatment expenses reduce both environmental impact and production costs. TSK Schill, certified to TÜV SÜD WHG standards, manufactures customized system modules with wastewater-reducing circuits and low-noise design. Distributed in Japan by World Link LLC.
- 企業：World Link LLC
- 価格：Other
